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 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
INFRARED EMITTING DIODES
LHIR3333-T50
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LHIR3333-T50 A A 08 - Dec - 2004
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHIR3333-T50 Page 1/4
Package Dimensions
5.0
5.9
7.6
8.6
1.5MAX 25.0MIN
1/4
0.5 TYP 1.0MIN 2.54TYP
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Features:
1. High radiant intensity. 2. Suitable for pulse applications. 3. Low average degradation.
Descriptions:
The LHIR3333-T50 series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in water clear plastic T-1 3/4 package individually
Device Selection Guide:
PART NO LHIR3333-T50
MATERIAL AlGaAs
LENS COLOR Water Clear
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHIR3333-T50 Page 2/4
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol HIR Forward Current Peak Forward Current (300PPS,1g s Pulse) Power Dissipation Reverse Voltagev Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Vr Topr Tstg Tsol 50 3 100 5 -55 ~ +100 -55 ~ +100 Max 260J for 5 sec Max (2mm from body) mA A mW V UNIT
J J
Electrical Optical Characteristics (Aa=25J )
PARAMETER Radiant Intensity Aperture Radiant Incidence Peak Wavelength Spectral Line Half Width Forward Voltage Reverse Current Viewing Angle SYMBOL Le Ee
Min. 20 3.3
Typ. 40 5.5 850 50
Max.
UNIT mW/sr mW/cm nm nm
2
TEST CONDITION IF=50mA IF=50mA IF=50mA IF=50mA IF=50mA VR=5V
f peak f
VF IR 2c 1/2
1.5
2.0 100
V
g A
deg
20
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The radiant intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHIR3333-T50 Page3/4
Typical Electro-Optical Characteristics Curve
HIR CHIP Fig.1 Forward Current vs. Rorward Voltage
1000
Fig.2 Relative Radiant Power vs. Wavelength
1.0
100 10 1 0.1 0.0
Relative Radiant Power Normalize @20mA
Forward Current[mA]
0.5
1.0
2.0
3.0
4.0
0.0 800
850
900
950
Forward Voltage[V]
Wavelength[nm]
Fig.3 Relative Radiant Power vs. Forward DC Current
10.0
Fig.4 Relative Radiant Power vs. Forward Peak Current
10.0
Relative Radiant Power Normalize @20mA
1.0
Relative Radiant Power Normalize @100 mA
1 10 100
1.0
0.1
0.1 10
100
1000
IFDC[mA]
IFPK[mA]
Fig.5 Forward DC Voltage vs. Temperature
1.2
Fig.6 Relative Radiant Power vs. Temperature
3.0
Forward DC Voltage Normalize @20mA, 25 J
Relative Radiant Power Normalize @ 20mA, 25J
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40
1.0
0.9
0.8 -40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
Ambient Temperature[J]
Ambient Temperature[J ]
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHIR3333-T50 Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 J O 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2


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